On the Radar…

Ascent Solar Technologies, Inc (NASDAQ:ASTI) announced the successful completion of internal qualification of the packaging for its flexible thin-film modules. Ascent’s proprietary technique allows for the deposition of CIGS (copper-indium-gallium-diselenide) on a plastic substrate. Ascent tested its packaging solution based on guidelines set forth by the International Electrotechnical Commission in IEC 61646. This testing includes withstanding 1000 hours of damp heat testing (85% humidity at 85° C). As a next step, these results will be verified by external agencies. Ascent, based in Thornton, Colorado, is scheduled to begin high volume manufacturer of thin film modules at its factory, also in Thornton, at the beginning of 2010.